Take The Heat Off

Solutions to help keep your devices performing at their best.

All-around solutions for EMI/EMC challenges

Safeguard your designs with 3M™ EMI/EMC Materials

Generated from common electronics and communications signals, thunderstorms and solar activity, electromagnetic frequencies and static electricity are part of everyday life. Though they are almost always present, these phenomena can interfere with electronic device performance, potentially causing errors or data loss. Reduce interference – and help protect your customers’ investments – by incorporating 3M™ EMI/EMC Materials into your products. These solutions block and/or absorb electromagnetic interference (EMI) from a wide variety of frequencies and sources to help keep electronics performing at their full potential. Complementing our EMI/EMC solutions, 3M offers Flux Field Directional Materials (FFDM) that are useful for magnetic shielding, wireless power charging and near field communications (NFC).

3M thermal management materials are designed to solve a wide range of heat-related challenges, efficiently and economically:  

Thermal Conductivity

Effective transfer of heat from components to cooling devices and systems

Conformability

The flexibility to place materials with precision and channel heat even in tight spaces

Dielectric Strength

Peace of mind that your materials will perform as intended without electrical interference or breakdown in insulating properties

Versitility

The ability to find the right solution for your specific application

Efficiency

Helps in effective control of heat without adding bulk to your designs or complexity to your manufacturing processes

Cost Effectiveness

More performance from less materials for a longer-lasting budget

Thermal Interface Materials

Fast and reliable service is crucial to success from sampling to prototyping to full-scale production. 3M™ Electronic Assembly Solutions include suggested thermal and EMI materials that cover many applications and provide differentiated solutions for a variety of thermal and EMI management needs. Make these materials your go-to option for EMI and thermal challenges, supplemented by a broader line of 3M™ Conductive Materials.

Odoo - Sample 1 for three columns

3M™ Thermally Conductive Interface Pads

3M Thermally Conductive Silicone Interface Pads performs well in applications requiring high temperatures. The soft silicone pads conform to a variety of substrates. These pads come in a variety of thicknesses to meet your design needs. Some can be customized beyond standard thicknesses for advanced designs. They can be die cut to fit individual applications, making them ideal for use in LEDs, automotive batteries, notebook modules and more.   

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    3M™ Thermally Conductive Tapes  

A full range of thin, highly conformable thermal interface and heat spreading tapes with high adhesion and excellent thermal conductivity. They apply quickly and easily, and their good dielectric strength make them appropriate for a wide variety of applications including bonding heat sinks, heat spreaders and other cooling devices to IC packages, power transistors and other heat generating components.  



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3M™ Electrically Conductive Tapes

3M Electrically Conductive Adhesive Transfer Tapes are intended to help you spare time in an assortment of specific electronics assembly operations, as well as enhancing the performance and dependability of your finalized products. These durable adhesive transfer tapes allow you to do away with traditional screws and mechanical fastenings, while permitting the utilization of lighter, more compact fabric foil shielding material goods.  


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3M™ EMI Absorbers

Another way to protect electronics from EMI interference is to absorb frequencies using materials incorporating specialized magnetic particles. EMI Absorbers are designed to dissipate and absorb EMI at most common frequencies. EMI Shielding Absorbers offer the benefits of EMI shielding and absorption together in one product for maximum protection. These materials are flexible and offer high permeability and magnetic loss in the targeted frequency range.  


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3M™ Flux Field Directional Materials

Near field communication (NFC), radio frequency identification (RFID) and wireless power charging (WPC) antennas often face unique interference challenges and can be optimized for performance using Flux Field Directional Material (FFDM) solutions. These low profile solutions can help improve WPC efficiency and NFC or RFID read ranges. 3M FFDM solutions can also be used for magnetic field shielding to help protect sensitive electronics.



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3M™ Electrically Conductive Gasket Tape

3M electrically conductive gasket tapes are useful for EMI/ RFI shielding and grounding in electronics and electrical devices. They can be applied in strips or die cut to specific shapes and sizes and provide good adhesion to most metal surfaces and good electrical resistance to many substrates. Compared to screws or other mechanical connectors and grounding means, they provide reduced assembly time and a solid bond line with no bond line gaps which might result in EMI emissions. 


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