Laird™ Tflex™ UT20500
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Tflex™ UT20500 is a specially formulated ultra-thin gap filler thermal interface material designed for thin interfaces that offers excellent thermal performance and high compliancy. It is designed without embedded reinforcing fiberglass to minimize contact resistance, yet still allows easy material handling and durability during assembly. Tflex™ UT20000 provides excellent interfacing and its ability to wet out mating surfaces allows for efficient transfer of heat away from components. It is an ideal choice for low-pressure applications and optimum solution in handheld devices with thin interface gap and limited space requirements.
- Thermal Conductivity of 3.0 W/mK
- No fiberglass carrier to minimize thermal resistance, yet still easy to handle
- Excellent surface wetting for low contact resistance
- Unique formulation minimizes thermal resistance at low mounting forces
- Environmentally friendly solution that meets regulatory requirements including RoHS and REACH
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In Stock: Ships in 1 - 2 days
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